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z-power led x10490 z-power led x10490 technical data sheet ssc- qp- 7- 07- 24 (rev.00) rev.04 rev.04 december december 2011 2011 www.seoulsemicon.com www.seoulsemicon.com specification STW8T16A customer customer customer customer approval approval drawn ssc ssc ssc ssc
z-power led x10490 z-power led x10490 technical data sheet ssc- qp- 7- 07- 24 (rev.00) rev.04 rev.04 december december 2011 2011 www.seoulsemicon.com www.seoulsemicon.com contents 1. description 2. absolute maximum ratings 3. electro-optical characteristics 4. optical characteristics 5. reliability test 6. color & binning 7. bin code description 8. outline dimension 9. reel structure 10. packing 11. soldering 12. precaution for use 13. handling of silicone resin leds
z-power led x10490 z-power led x10490 technical data sheet ssc- qp- 7- 07- 24 (rev.00) rev.04 rev.04 december december 2011 2011 www.seoulsemicon.com www.seoulsemicon.com STW8T16A features applications STW8T16A ? white colored smt package. ? pb-free reflow soldering application ? suitable for all smt assembly methods ; suitable for all soldering methods ? rohs compliant ? interior lighting ? general lighting ? indoor and out door displays ? architectural / decorative lighting this surface-mount led comes in standard package dimension. it has a substrate made up of a molded plastic reflector sitting on top of a bent lead frame. the die is attached within the reflector cavity and the cavity is encapsulated by silicone. the package design coupled with careful selection of component materials allow these products to perform with high reliability. 1. description
z-power led x10490 z-power led x10490 technical data sheet ssc- qp- 7- 07- 24 (rev.00) rev.04 rev.04 december december 2011 2011 www.seoulsemicon.com www.seoulsemicon.com 3. electro-optical characteristics cd - 6.4 - i f =60ma i v luminous intensity* [1] (2,600~3,700 k) oc/w - 22 - i f =60ma r th js thermal resistance [3] k 7,000 - 2,600 i f =60ma cct color correlated temperature deg. - 120 - i f =60ma 2 1/2 viewing angle [2] kv - - 5 1.5k ? ;100pf esd (hbm) - 90 - 80 i f =60ma ra color rendering index* cd - 6.8 - i f =60ma i v luminous intensity* [1] (3,700~7,000 k) v 1.2 0.9 - i r =5ma v r reverse voltage v 3.4 3.1 2.9 i f =60ma v f forward voltage unit max. typ. min. condition symbol parameter [1] the luminous intensity iv was measured at the p eak of the spatial pattern which may not be aligne d with the mechanical axis of the led package. [2] 2 1/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity. [3] thermal resistance: rthjs (junction / solder) * tolerance : vf : 0.1v, iv : 10%, ra : 3, x,y : 0.01 [note] all measurements were made under the standar dized environment of ssc. 125 t j junction temperature -40~+100 t stg storage temperature -40~+85 t opr operating temperature ma 90 i f forward current mw 315 p d power dissipation unit value symbol parameter [1] care is to be taken that power dissipation does not exceed the absolute maximum rating of the prod uct. * leds properties might be different from suggeste d values like above and below tables if operation co ndition will be exceeded our parameter range. 2. absolute maximum ratings [1]
z-power led x10490 z-power led x10490 technical data sheet ssc- qp- 7- 07- 24 (rev.00) rev.04 rev.04 december december 2011 2011 www.seoulsemicon.com www.seoulsemicon.com 4. optical characteristics ambient temperature vs. maximum forward current forward voltage vs. forward current ta=25 forward current vs. relative luminous intensity ta=25 directivity ta=25 -90 60 30 0 -30 -60 90 -2 5 0 2 5 5 0 7 5 1 0 0 0 3 0 6 0 9 0 forward current i f [ma] a m b ie n t te m p e r a tu re t a ( o c ) rthj-a : 200 /w 0 10 20 30 40 50 60 70 80 90 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 relative luminous intensity forward current i f [ma] 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 0 10 20 30 40 50 60 70 80 90 forward current i f [ma] forward voltage v f [v]
z-power led x10490 z-power led x10490 technical data sheet ssc- qp- 7- 07- 24 (rev.00) rev.04 rev.04 december december 2011 2011 www.seoulsemicon.com www.seoulsemicon.com 4. optical characteristics relative light output vs. junction temperature i f =60ma forward voltage shift vs. junction temperature i f =60ma spectrum ta=25 , i f =60ma 30 45 60 75 90 105 120 0.0 0.2 0.4 0.6 0.8 1.0 relative forward voltage ju n ctio n te m p e ra tu re t j( o c ) 30 45 60 75 90 105 120 0.0 0.2 0.4 0.6 0.8 1.0 relative light output junction tem perature tj( o c) 300 400 500 600 700 800 0.0 0.5 1.0 4700~8200k 3700~4700k 2600~3700k relative emission intensity wavelength [nm]
z-power led x10490 z-power led x10490 technical data sheet ssc- qp- 7- 07- 24 (rev.00) rev.04 rev.04 december december 2011 2011 www.seoulsemicon.com www.seoulsemicon.com 5. reliability test 0/22 3 time 260 < 10sec. reflow soldering t sol reflow 0/22 3 time 5kv at 1.5k ? ; 100pf mil-std- 883d esd(hbm) 0/22 1000 hours t a =-40 o c, i f =60ma internal reference low temperature life test 0/22 500 hours t a =85 o c, i f =60ma internal reference high temperature life test 0/22 500 hours t a =60 o c, rh=90%, i f =60ma internal reference high temperature high humidity life test 0/22 1000 hours t a =25 o c, i f =60ma internal reference operating endurance test 0/22 1000 hours t a =-40 o c eiaj ed-4701 low temperature storage 0/22 1000 hours t a =60 o c, rh=90% eiaj ed-4701 high temp. high humidity storage 0/22 1000 hours t a =100 o c eiaj ed-4701 high temperature storage 0/22 100 cycle t a =-40 o c(30min) ~ 100 o c(30min) eiaj ed-4701 thermal shock number of damaged duration / cycle test conditions reference item - lsl [2] 0.7 i f =60ma i v luminous intensity usl [1] 1.2 - i f =60ma v f forward voltage max min criteria for judgment condition symbol item note : [1] usl : upper standard level [2] lsl : lower standard level criteria for judging the damage
z-power led x10490 z-power led x10490 technical data sheet ssc- qp- 7- 07- 24 (rev.00) rev.04 rev.04 december december 2011 2011 www.seoulsemicon.com www.seoulsemicon.com 6. color & binning 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 h3 h5 h1 h4 h2 h0 g5 g3 g1 g4 g2 g0 f5 f3 f1 f4 f2 f0 e5 e3 e1 e4 e2 d0 d5 d3 d1 d4 d2 e0 c5 c3 c1 c4 c2 c0 b5 b3 b1 b4 b2 b0 a3 a5 a1 a4 a2 a0 2600k 2700k 2900k 3000k 3200k 3500k 3700k 4000k 4200k 4500k 4700k 5000k 5300k 5600k 6000k 6500k 7000k cie y cie x energy star rank energy star rank
z-power led x10490 z-power led x10490 technical data sheet ssc- qp- 7- 07- 24 (rev.00) rev.04 rev.04 december december 2011 2011 www.seoulsemicon.com www.seoulsemicon.com color rank * measurement uncertainty of the color coordinates : 0.01 6. color & binning 0.3451 0.3369 0.3384 0.3293 0.3534 0.3373 0.3369 0.3366 0.3306 0.3294 0.3451 0.3369 0.3306 0.3294 0.3243 0.3222 0.3384 0.3293 0.3384 0.3293 0.3316 0.3217 0.3461 0.3293 cie y cie x cie y cie x cie y cie x b5 b4 b3 0.3461 0.3293 0.3616 0.3376 0.3539 0.3292 0.3384 0.3293 0.3534 0.3373 0.3461 0.3293 0.3316 0.3217 0.3461 0.3293 0.3389 0.3212 0.3389 0.3212 0.3539 0.3292 0.3462 0.3207 cie y cie x cie y cie x cie y cie x b2 b1 b0 0.3334 0.3216 0.3256 0.3136 0.3408 0.321 0.3261 0.3221 0.3187 0.3146 0.3334 0.3216 0.3187 0.3146 0.3113 0.3068 0.3256 0.3136 0.3256 0.3136 0.3177 0.3055 0.3324 0.3126 cie y cie x cie y cie x cie y cie x a5 a4 a3 0.3324 0.3126 0.3481 0.3205 0.3393 0.3115 0.3256 0.3136 0.3408 0.321 0.3324 0.3126 0.3177 0.3055 0.3324 0.3126 0.324 0.3041 0.324 0.3041 0.3393 0.3115 0.3304 0.3028 cie y cie x cie y cie x cie y cie x a2 a1 a0
z-power led x10490 z-power led x10490 technical data sheet ssc- qp- 7- 07- 24 (rev.00) rev.04 rev.04 december december 2011 2011 www.seoulsemicon.com www.seoulsemicon.com color rank * measurement uncertainty of the color coordinates : 0.01 6. color & binning 0.3677 0.3692 0.3616 0.3608 0.3775 0.3714 0.3578 0.367 0.3521 0.359 0.3677 0.3692 0.3521 0.359 0.3465 0.3511 0.3616 0.3608 0.3616 0.3608 0.3555 0.3523 0.3711 0.3625 cie y cie x cie y cie x cie y cie x d5 d4 d3 0.3711 0.3625 0.3874 0.3736 0.3804 0.3641 0.3616 0.3608 0.3775 0.3714 0.3711 0.3625 0.3555 0.3523 0.3711 0.3625 0.3646 0.3536 0.3646 0.3536 0.3804 0.3641 0.3736 0.3548 cie y cie x cie y cie x cie y cie x d2 d1 d0 0.3578 0.3526 0.3514 0.3448 0.3669 0.3539 0.3487 0.3514 0.3428 0.344 0.3578 0.3526 0.3428 0.344 0.3369 0.3366 0.3514 0.3448 0.3514 0.3448 0.3451 0.3369 0.3601 0.3456 cie y cie x cie y cie x cie y cie x c5 c4 c3 0.3601 0.3456 0.376 0.3552 0.3687 0.3463 0.3514 0.3448 0.3669 0.3539 0.3601 0.3456 0.3451 0.3369 0.3601 0.3456 0.3534 0.3373 0.3534 0.3373 0.3687 0.3463 0.3616 0.3376 cie y cie x cie y cie x cie y cie x c2 c1 c0
z-power led x10490 z-power led x10490 technical data sheet ssc- qp- 7- 07- 24 (rev.00) rev.04 rev.04 december december 2011 2011 www.seoulsemicon.com www.seoulsemicon.com color rank * measurement uncertainty of the color coordinates : 0.01 6. color & binning 0.3931 0.4198 0.3865 0.4062 0.4048 0.4248 0.3814 0.4147 0.3751 0.4017 0.3931 0.4198 0.3751 0.4017 0.369 0.3889 0.3865 0.4062 0.3865 0.4062 0.3798 0.3925 0.3978 0.4104 cie y cie x cie y cie x cie y cie x f5 f4 f3 0.3978 0.4104 0.4165 0.4299 0.4089 0.4146 0.3865 0.4062 0.4048 0.4248 0.3978 0.4104 0.3798 0.3925 0.3978 0.4104 0.3907 0.396 0.3907 0.396 0.4089 0.4146 0.4015 0.3996 cie y cie x cie y cie x cie y cie x f2 f1 f0 0.3825 0.3934 0.3751 0.3813 0.3935 0.397 0.3716 0.3898 0.3646 0.3783 0.3825 0.3934 0.3646 0.3783 0.3578 0.367 0.3751 0.3813 0.3751 0.3813 0.3677 0.3692 0.3855 0.3842 cie y cie x cie y cie x cie y cie x e5 e4 e3 0.3855 0.3842 0.4044 0.4006 0.3958 0.3869 0.3751 0.3813 0.3935 0.397 0.3855 0.3842 0.3677 0.3692 0.3855 0.3842 0.3775 0.3714 0.3775 0.3714 0.3958 0.3869 0.3874 0.3736 cie y cie x cie y cie x cie y cie x e2 e1 e0
z-power led x10490 z-power led x10490 technical data sheet ssc- qp- 7- 07- 24 (rev.00) rev.04 rev.04 december december 2011 2011 www.seoulsemicon.com www.seoulsemicon.com color rank * measurement uncertainty of the color coordinates : 0.01 6. color & binning 0.4069 0.4666 0.4042 0.4551 0.4194 0.474 0.3944 0.4593 0.3919 0.4483 0.4069 0.4666 0.3919 0.4483 0.3893 0.4373 0.4042 0.4551 0.4042 0.4551 0.4015 0.4436 0.4166 0.462 cie y cie x cie y cie x cie y cie x h5 h4 h3 0.4166 0.462 0.4319 0.481 0.4289 0.4687 0.4042 0.4551 0.4194 0.474 0.4166 0.462 0.4015 0.4436 0.4166 0.462 0.4138 0.4499 0.4138 0.4499 0.4289 0.4687 0.426 0.4562 cie y cie x cie y cie x cie y cie x h2 h1 h0 0.4015 0.4436 0.3973 0.4317 0.4138 0.4499 0.3893 0.4373 0.3853 0.4259 0.4015 0.4436 0.3853 0.4259 0.3814 0.4147 0.3973 0.4317 0.3973 0.4317 0.3931 0.4198 0.4093 0.4374 cie y cie x cie y cie x cie y cie x g5 g4 g3 0.4093 0.4374 0.426 0.4562 0.4212 0.443 0.3973 0.4317 0.4138 0.4499 0.4093 0.4374 0.3931 0.4198 0.4093 0.4374 0.4048 0.4248 0.4048 0.4248 0.4212 0.443 0.4165 0.4299 cie y cie x cie y cie x cie y cie x g2 g1 g0
z-power led x10490 z-power led x10490 technical data sheet ssc- qp- 7- 07- 24 (rev.00) rev.04 rev.04 december december 2011 2011 www.seoulsemicon.com www.seoulsemicon.com 7. bin code description z2 a1 q0 forward voltage [v] color rank luminous intensity [mcd] bin code 2,600k ~ 7,000k 2,600k ~ 7,000k 2,600k ~ 7,000k 2,600k ~ 7,000k 2,600k ~ 7,000k 2,600k ~ 7,000k 2,600k ~ 7,000k 2,600k ~ 7,000k a~h color rank @ i f = 60ma available ranks not yet available ranks 3.4 3.3 a1 3.0 2.9 y3 3.1 3.0 z1 3.2 3.1 z2 3.3 3.2 z3 max. min. rank forward voltage [v] @ i f = 60ma [note] all measurements were made under the standar dized environment of ssc. in order to ensure availability, single color rank & iv rank & vf rank will not be orderable. [1] classification criteria : luminous intensity iv [2] please use for only reference. 22.6 8,000 7,500 q5 21.2 19.7 18.5 typ. flux * [2] [lm] 7,500 7,000 q0 7,000 6,500 p5 6,500 6,000 p0 max. min. rank luminous intensity [mcd] * [1] @ i f = 60ma q5 q5 q5 iv rank q0 q0 q0 p5 p0 3,700~4,700 k p5 p0 4,700~7,000 k p5 p0 2,600~3,700 k cct
z-power led x10490 z-power led x10490 technical data sheet ssc- qp- 7- 07- 24 (rev.00) rev.04 rev.04 december december 2011 2011 www.seoulsemicon.com www.seoulsemicon.com 8.outline dimension right view front view rear view 4 5 6 1 2 3 package marking (cathode) package outlines r e c o m m e n d e d s o l d e r p a d ( tolerance: 0.2, unit: mm ) circuit diagram esd protection device anode 6, 5, 4 1, 2, 3 cathode
z-power led x10490 z-power led x10490 technical data sheet ssc- qp- 7- 07- 24 (rev.00) rev.04 rev.04 december december 2011 2011 www.seoulsemicon.com www.seoulsemicon.com 5.7 0.1 (4.75) 12.0 0.2 5.3 2.1 0.1 1.75 0.1 5.5 0.05 0.3- 0.05 4 0.1 2 0.05 8 0.1 ? 1 . 5 + 0 . 1 , - 0 180 2 13 22 60 15.4 1.0 13 0.3 9. reel structure ( tolerance: 0.2, unit: mm ) 1)quantity : 1,200pcs/reel 2)cumulative tolerance : cumulative tolerance/10 pi tches to be 0.2mm 3)adhesion strength of cover tape : adhesion streng th to be 0.1-0.7n when the cover tape is turned off from the carrier tape at the angle of 10 to the carrier tape 4)package : p/n, manufacturing data code no. and qu antity to be indicated on a damp proof package package marking
z-power led x10490 z-power led x10490 technical data sheet ssc- qp- 7- 07- 24 (rev.00) rev.04 rev.04 december december 2011 2011 www.seoulsemicon.com www.seoulsemicon.com 1 side outer box structure material : paper(sw3b(b)) a b c 1 humidity indicator aluminum vinyl bag reel desi pak part number : lot number : xxxxxxxxxx quantity : xxxx seoul semiconductor co., ltd. part number : lot number : xxxxxxxxxx quantity : xxxx seoul semiconductor co., ltd. part number : lot number : xxxxxxxxxx quantity : xxxx seoul semiconductor co., ltd. type 7inch size (mm) 220 245 245 220 a b 102 142 c acriche semiconductor ecolight rohs tuv made in korea 10. packing
z-power led x10490 z-power led x10490 technical data sheet ssc- qp- 7- 07- 24 (rev.00) rev.04 rev.04 december december 2011 2011 www.seoulsemicon.com www.seoulsemicon.com 11. soldering lead solder 2.5~5 c / sec. o o o pre-heating 120~150 c 120sec. max. 60sec. max. above 200 c o 240 c max. 10 sec. max. 2.5~5 c / sec. (1) lead solder (2) lead-free solder (3) hand soldering conditions do not exceed 4 seconds at maximum 315oc under sold ering iron. [note] in case that the soldered products are reus ed in soldering process, we dont guarantee the pro ducts. (4) the encapsulated material of the leds is silicon e. precautions should be taken to avoid the strong pre ssure on the encapsulated part. so when using the chip mounter, the picking up nozzle that does not affect the sili cone resign should be used. (5) it is recommended that the customer use the nit rogen reflow method. (6) repairing should not be done after the leds have been soldered. (7) reflow soldering should not be done more than t wo times. in the case of more than 24 hours passed soldering after first, leds will be damaged. (8) we recommend using solder paste composed of agcus n, because pastes that contain bi or b might cause color change of ag during surface mount technology. lead-free solder 1~5 c / sec. o o o o 1~5 c / sec. pre-heating 150~200 c 120sec. max. 60sec. max. above 220 c o 260 c max. 10 sec. max. 10 sec. max. soldering time condition 240 max. peak-temperature 120 sec. max. pre-heat time 120~150 pre-heat lead solder 10 sec. max. soldering time condition 260 max. peak-temperature 120 sec. max. pre-heat time 150~200 pre-heat lead free solder
z-power led x10490 z-power led x10490 technical data sheet ssc- qp- 7- 07- 24 (rev.00) rev.04 rev.04 december december 2011 2011 www.seoulsemicon.com www.seoulsemicon.com 12. precaution for use 1) storage in order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator ) with a desiccant. otherwise, to store them in the fo llowing environment is recommended. temperature : 5oc ~30oc humidity : maximum 70%rh 2) attention after open. led is correspond to smd, when led be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensit y to drop. attention in followed; a. after opened and mounted the soldering shall be quickly. b. keeping of a fraction temperature : 5 ~ 40oc humidity : less than 30% 3) in the case of more than 1 week passed after ope ning or change color of indicator on desiccant, components shall be dried 10-12hr. at 60 5oc. 4) silver plating might be tarnished in the environ ment that contains corrosive gases and materials. also any product that has tarnished lead might be d ecreased the solder-ability and optical-electrical properties compare to normal ones. please do not expose the product in the corrosive e nvironment during the storage. 5) any mechanical force or any excess vibration sha ll not be accepted to apply during cooling process to normal temperature after soldering. 6) quick cooling shall be avoided. 7) components shall not be mounted on warped direct ion of pcb. 8) anti radioactive ray design is not considered fo r the products. 9) this device should not be used in any type of fl uid such as water, oil, organic solvent etc. when washing is required, ipa should be used. 10) when the leds are illuminating, operating curren t should be decided after considering the ambient maximum temperature. 11) the leds must be soldered within seven days afte r opening the moisture-proof packing. 12) repack unused products with anti-moisture packi ng, fold to close any opening and then store in a dry place. 13) the appearance and specifications of the produc t may be modified for improvement without notice. 14) please note the information contained herein is subject to change. ssc reserves the right to modify or change the desi gn of led package inside structure without prior notice unless optical performance cha nges.
z-power led x10490 z-power led x10490 technical data sheet ssc- qp- 7- 07- 24 (rev.00) rev.04 rev.04 december december 2011 2011 www.seoulsemicon.com www.seoulsemicon.com 13. handling of silicone resin leds 1) during processing, mechanical stress on the surf ace should be minimized as much as possible. sharp objects of all types should not be used to pi erce the sealing compound. 2) in general, leds should only be handled from the side. by the way, this also applies to leds without a silicone sealant, since the surface can a lso become scratched. 3) when populating boards in smt production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical press ure on the surface of the resin must be prevented. this is assured by choosing a pick and place nozzle which is larger than the leds reflector area. 4) silicone differs from materials conventionally u sed for the manufacturing of leds. these conditions must be considered during the handling of such devi ces. compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. as mentioned previously, the increased sensitivity to dust requires special care during processing. in cases where a minimal level of dirt and dust par ticles cannot be guaranteed, a suitable cleaning sol ution must be applied to the surface after the soldering of components. 5) ssc suggests using isopropyl alcohol for cleanin g. in case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. ultrasonic cleaning is not recommended. ultrasonic cleaning may cause damage to the led. 6) please do not mold this product into another res in (epoxy, urethane, etc) and do not handle this product with acid or sulfur mate rial in sealed space.

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